High Performance Rackmount Compact Storage Server for Network Virtualization

• Customization: Available
• Application: Enterprise Level
• Instruction System: RISC
• Model NO.: TJYC-2200-S, TJYC-2200-D, TJYC-2200-G
• Max. CPUs: 2-4
• Number of CPu Threads: 20
• Server Form Factor: 2u/4u/8u
• Storage Capacity: >1TB
• Supporting Memory Capacity: >1TB
• System Architecture: X86 Server
• Form Factor: 447×87×707 mm
• Management Interface: iDRAC
• Network Connectivity: 2× 1gbe + 2× 10gbe (Ocp 3.0 Optional)
• Operating System: Windows/Linux
• Power Supply: 1+1 Redundant PSU 550W/800W/1200W
• Processor Type: Intel Xeon Scalable / AMD Epyc
• RAM Capacity: 2tb
• Certifications: ISO9001, RoHS
• Warranty Period: 3-Year Warranty
• GPU: 2-4 × GPU (Ai Training/Inference Configuration)
• Management: BMC/Ipmi Remote Management; Supports Ikvm
• Transport Package: Standard International Export Packaging
• Specification: 25-30 kg
• Trademark: TJYC
• Origin: China
• Package Size: 80.00cm * 60.00cm * 30.00cm
• Package Gross Weight: 35.000kg

Product Description

Product Description

The enterprise-level servers include rack mounted server, tower server, liquid cooling server designed for enterprise data centers, cloud computing, and AI workloads. Built on Intel Xeon Scalable or AMD EPYC platforms with single or dual sockets, it supports up to 2TB of DDR4/DDR5 ECC memory across 16 DIMM slots.

Key features:
- Flexible storage: 8 to 12 hot-swap 3.5"/2.5" SAS/SATA/NVMe drive bays with RAID 0/1/5/10 support
- Networking: 2x 1GbE plus 2x 10GbE ports (OCP 3.0 optional)
- Redundant (1+1) platinum / titanium power supplies (550W / 800W / 1200W)
- Out-of-band management via BMC / IPMI with iKVM remote control
- Optional GPU configurations (2 to 4 GPUs) for AI training and inference
- Standard 19-inch 2U rackmount form factor, dimensions about 447 x 87 x 707 mm, weight about 25 to 30 kg
- Certifications: ISO9001, RoHS, 3-year warranty

Ideal for HPC, virtualization, storage, and edge computing. Three models cover base (RS-2200-S), high-performance dual-socket (RS-2200-D), and GPU/AI (RS-2200-G) deployments.

Country of Origin	China
Brand	TBD / TuoJie YunChuang (example)
Product Type	Rack Mounted Server,Tower Server,Liguid/Air Cooling Server, AI Server
Form Factor	2U/4U/6U/8U  (19-inch standard rack)
Processor	Intel Xeon Scalable / AMD EPYC (single-socket or dual-socket optional)
Memory	DDR4/DDR5 ECC RDIMM, 16 slots, up to 2TB max
Storage	8–12 × 3.5"/2.5" SAS/SATA/NVMe hot-swappable; supports RAID 0/1/5/10
Networking	2× 1GbE + 2× 10GbE (OCP 3.0 optional)
Power Supply	1+1 redundant power supplies 550W / 800W / 1200W (Platinum / Titanium)
Management	BMC/IPMI remote management with iKVM support
GPU	Optional 2–8 × GPU (for AI training/inference configurations)
Dimensions	Approx. 447 × 87 × 707 mm; Weight: approx. 25–30 kg
Certifications & Warranty	ISO9001, RoHS compliant; 3-year warranty

Company Profile

As a dynamic system integrator and specialized international high-tech export distributor, we act as the exclusive export agent for a premier state-owned wireless communication SoC platform provider. We operate a diversified high-tech business portfolio encompassing wireless communication core products, full-spectrum computing equipment, semiconductor devices, industrial IoT solutions and advanced new materials. Backed by long-term strategic partnerships with domestic research institutes and top-tier scientific research institutions, we deliver secure, robust and future-proof technological products and tailored solutions to meet the diverse procurement and customized technical requirements of global industrial clients.
Our core technological edge stems from our pioneering Software-Defined Radio (SDR) SoC technology. Leveraging our proprietary "One Chip, Multiple Uses" design concept, our devices support a full spectrum of communication scenarios, ranging from 2G to 5G cellular networks, V2X and NTN systems to diversified specialized private communication applications. This versatile technical architecture enables us to address customized connectivity needs across diverse industries and global markets.

Diversified High-Tech Business Portfolio
Beyond our flagship wireless communication product line, we have built a comprehensive and multi-dimensional high-tech export system covering four core product segments. Our primary business scope includes: 
1.Data center computing equipment, covering servers, mainstream switches and SAN switches;
2.Industrial-grade rugged computing hardware, including ruggedized computers and ruggedized switches for harsh industrial scenarios; 
3.Wireless communication products, consisting of SoC chips, SDR devices and lightweight ad-hoc network products;

4.And fourth, professional semiconductor products. Supported by authoritative cooperation with renowned research institutes and scientific research bodies, we enjoy stable and high-quality product supply and sustainable technological innovation capabilities. 
Complementing our core offerings, we also provide intelligent industrial IoT solutions and advanced AI products. Our AI division serves as a key emerging business segment, supplying high-performance, innovative chips widely applied in electronic communication, intelligent manufacturing and high-end industrial sectors. All products comply with international trade and quality standards, delivering reliable product supply and professional integrated supply chain solutions for global partners.

Upholding the one-stop integrated service philosophy, we aim to serve as your reliable exclusive supplier for diversified advanced technologies and high-end industrial materials, fully satisfying global partners' demands for integrated procurement and long-term technical cooperation.
Professional & Trustworthy Service Expertise
Premium professional services constitute our core competitive advantage in global cross-border trade. We maintain an experienced international team proficient in technical consultation, business negotiation, project implementation and after-sales support. We provide full-lifecycle services covering in-depth technical consultancy, personalized solution customization, product adaptive optimization and standardized cross-border after-sales services, ensuring seamless, efficient and risk-free cooperation for all global partners.

Core Strengths & Key Highlights
•Exclusive Authorized Channel: The sole official export channel of the leading IC design institute, granting us exclusive authoritative product resources and market advantages.
•Strong Innovation Strength: Backed by a seasoned R&D team with over 20 years of industrial expertise and 129+ authorized technical patents, we sustain continuous technological iteration and independent product innovation.
•Full-Spectrum Product Layout: A comprehensive product matrix covering data center computing equipment, industrial rugged devices, wireless communication systems, semiconductor products, industrial IoT solutions and high-performance new materials. Empowered by in-depth cooperation with top research institutions, we cover multiple high-growth high-tech industry tracks.
Full-Lifecycle Professional Services: Our expert team delivers targeted, customized support throughout the entire project process, including project docking, technical customization, bulk procurement and after-sales assurance, tailoring exclusive integrated solutions for global clients.

Certifications

Packaging & Shipping

Packaging

 All products are carefully packaged in accordance with international export standards to ensure safe delivery. Our standard packaging includes:

 Anti-static & moisture-proof protection: Semiconductor products, SoC chips, and SDR devices are packaged in anti-static shielding bags with desiccant and moisture-barrier materials to prevent electrostatic discharge and humidity damage during transit.

 Rugged outer packaging: Industrial-grade computing equipment and ruggedized hardware are secured in custom-designed cartons or wooden crates with shock-absorbing foam inserts to withstand harsh shipping conditions.

 Clear labeling: Each package is clearly marked with product name, quantity, gross weight, handling instructions, and destination information for easy identification and traceability.

 Customized packaging solutions are available upon request to meet specific customer requirements, including special labeling, branded packaging, or consolidated container loading.

 

Shipping

 We offer flexible and reliable shipping options to serve global customers efficiently:

 Shipping methods: Sea freight, air freight, and international courier services (DHL, FedEx, UPS) are available based on order volume, urgency, and customer preference.

 Major ports: Shipments are typically dispatched from major Chinese ports including Shanghai, Shenzhen, and Beijing, with convenient access to major global shipping routes.

 Incoterms: We support a wide range of International Commercial Terms including FOB, CIF, EXW, CFR, DAP, and DDP to accommodate diverse trade requirements.

 Lead time: Standard lead time ranges from 7 to 30 days after order confirmation, depending on product type, order quantity, and customization requirements. Peak season lead times may vary—please contact our sales team for current estimates.

 Order tracking: Real-time tracking information is provided for all shipments, allowing customers to monitor their orders from dispatch to final delivery.

 For urgent or small-volume orders, express courier services with door-to-door delivery can be arranged. We are committed to ensuring that your products arrive safely, on time, and in perfect condition.

FAQ

Q1: What is your company's main business scope?
 A: We are a dynamic system integrator and specialized international high-tech export distributor, serving as the exclusive export agent for a premier state-owned wireless communication SoC platform provider. Our diversified business portfolio covers wireless communication core products (SoC chips, SDR devices, ad-hoc network products), data center computing equipment (servers, switches, SAN switches), industrial-grade rugged computing hardware, semiconductor products, industrial IoT solutions.
 
Q2: What products does your company mainly supply?
 A: Our primary product categories include:
SoC chips and SDR (Software-Defined Radio) communication devices
Ad-hoc network modules and boards
Data center servers, switches, and SAN switches
Ruggedized computers and industrial-grade switches
Semiconductor devices and high-performance AI chips
 
 
Q3: Do you support OEM or customized orders?
 A: Yes, we provide comprehensive customization services. Leveraging our in-depth technical expertise and long-term partnerships with top-tier research institutions, we offer tailored solutions including product adaptive optimization, customized technical specifications, and specialized configurations to meet diverse industrial requirements.
 
Q4: What is the minimum order quantity (MOQ)?
 A: Minimum order quantity varies by product type and specification. For standard products, MOQ is typically flexible. Trial orders and sample orders are welcome for evaluation purposes. Please contact our sales team with your specific requirements for detailed MOQ information.
 
Q5: What payment terms do you accept?
 A: We accept multiple payment methods to facilitate smooth transactions, including T/T (Telegraphic Transfer), and Western Union. Payment terms are negotiable based on order value, cooperation history, and specific trade conditions.
 
Q6: How do you arrange shipping and delivery?
 A: We support flexible shipping arrangements including sea freight, air freight, and international courier services. Common trade terms we support include FOB, CIF, EXW. Shipments are dispatched from major Chinese ports such as Shanghai, Shenzhen, and Beijing. We provide real-time tracking information for all orders.

Q7: What is the typical lead time for orders?
 A: Standard lead time ranges from 7 to 30 days after order confirmation, depending on product type, order quantity, and customization requirements. Peak season lead times may be longer—please consult our sales team for current estimates.
 
Q8: How do you ensure product quality?
 A: Quality is our top priority. All products undergo rigorous inspection during production and before shipment to ensure they meet agreed quality standards. Our R&D team possesses nearly 20 years of successful experience in mass production of Large-Scale Integrated Circuits and communication chips. We hold 129+ authorized technical patents and maintain strict quality control protocols throughout the entire production and supply chain.
 
Q9: Do you provide after-sales support and technical services?
 A: Yes, we offer full-lifecycle professional services including in-depth technical consultancy, personalized solution customization, product adaptive optimization, and standardized cross-border after-sales support. Our experienced international team is proficient in technical consultation, project implementation, and troubleshooting to ensure seamless cooperation for all global partners.
 
Q10: Can I visit your company or factory?
 A: Yes, business visits are welcome by appointment. We are happy to arrange factory tours and face-to-face meetings to discuss cooperation opportunities and demonstrate our technical capabilities. Please contact us in advance to schedule your visit.
 
Q11: What are your core competitive advantages?
 A: Our core strengths include: (1) Exclusive authorized channel as the sole official export agent of a leading IC design institute; (2) Strong innovation capability backed by 20+ years of industry expertise and 129+ authorized patents; (3) Full-spectrum product portfolio covering multiple high-tech industry tracks; and (4) Full-lifecycle professional services with customized integrated solutions for global clients.